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Beoplay 中国官网热界面胶带ST-TIM系列

2016/6/15 15:48:06      点击:

1. 产品概要 Product profile

产品能在电子器件和散热片之间提供高效的导热通道,有很好的粘性,可以把发热体和散热体固定在一起,

做为一个整体,增强散热效果,使其电子器件与散热器之间不再需要机械固定和液体胶粘剂固化固定。

This product offer a efficient heat conductive channel between electron device and heat sink and good bonding properties which can fasten heat element and heat dissipation elements together, which can improve heat spread effect as a whole and unnecessary to fasten by mechanical fixation and liquid adhesive


2. 典型产品结构 Typical product structure

离型层release liner导热胶粘剂thermal adhensive

热界面胶黏剂Thermal interface adhensive

热介层(Cu/AI/玻纤布)Thermal dielectric layer (Cu/AI/ glass fiber cloth)

热界面胶黏剂Thermal interface adhensive

导热胶粘剂thermal adhensive


典型物性表Typical specification

试验项目(Test items )

测试方法(Test method)

基准值(Value)

厚度Thickness ( m m)

基材Base material

粘着力Adhesive force

导热系数(垂直)

Thermal conductivity coefficient (verticality)

ASTM D 3652

ASTM D 3330

ASTM D 5470

150±5% ( nm)玻纤布Rip stop Avg. 1.15 (gf/25mm)

800 W/mK


4. 适用范围 Application

-大功率LED照明铝基板,

-CPU、南桥或显存芯片,内存芯片、硬盘
-M0S管、大功率晶体管

-LED背光源模组TV安装弹性加热薄片、柔性电路等
-High-power LED lighting aluminum plate,

-CPU, south Bridge or video memory chip, RAM chip, hard disk
—MOS tubes, high-power transistors

-The back -lit module ,TV assembling flexibility heating sheets,

FPCB, etc


5. 包装事项Packing

规格DIM 500mmx1 00m

注:产品结构、材料组合、厚度和规格可按客户要求定制。

Note: product structure, material composition, thickness and specifications can be customized according to customer requirements.


热界面胶带ST-TIM系列联系电话:186-6124-5847 许先生